Maintenance Cleaning

Removing flux residues from reflow ovens, wave solder systems, conveyor fingers, condensation traps, and other applications

As part of a maintenance cleaning program, the most prevalent types of contamination, such as baked-on fluxes and recondensed gas emissions from the soldering process, must be removed to ensure a reliable and failure-free production process.

Other parts that require maintenance cleaning include dispensing needles, solder pallets, conveyor fingers, condensation traps as well as the reflow ovens and wave solder machines.

ZESTRON offers aqueous-based MPC® and FAST® cleaning agents and modern solvents for maintenance and tool cleaning applications in the electronics manufacturing industry.  These maintenance cleaning products can be used manually as well as in ultrasonic, spray-in-air and spray-under-immersion equipment.

Aqueous and Solvent Based Maintenance Cleaning Agents

Cleaning agent options for maintenance applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.  

Water-based cleaning agent for the removal of conformal coating material from pallets, fixtures, and tools.

Water-based cleaning medium for baked-on flux removal

For spray-under-immersion or air assisted cleaning, also for cyclones

For easy and fast dispensing in reflow oven and wave solder system cleaning applications

Water-based cleaning agent for reflow and wave solder ovens

Water-based cleaning agent for reflow ovens and wave solder systems

Solvent-based cleaning medium for SMT adhesive removal


Bath monitoring
Cleaner regeneration
FAST® Technology
HYDRON® Technology
Low standoff
Maintenance cleaning
Manual cleaning
Metal cleaning
MPC® Technology
PH neutral
Power Electronics
For sensitive surfaces
Spray bottle
Stencils & Screens
Surface Analysis
Underside wiping