During the soldering process, evaporated fluxes as well as gas emissions from solder paste are deposited onto the internal surfaces of the reflow oven.  An increased level of flux precipitate and gas emissions can lead to an unstable reflow profile as the desired peak temperature in each zone cannot be consistently reached.  Moreover, during  subsequent reflow processes, contaminants from gas emissions can be redeposited onto the next assembly.   

Therefore, regular cleaning of reflow ovens ensures the stability of the reflow process. For this application, ZESTRON offers aqueous-based MPC® maintenance cleaning agents.

In addition to their improved cleaning performance as compared to ordinary alcohols, these MPC® based products have no flash point.  Therefore, they can be directly applied to warm surfaces.  Due to a short soaking time, a quick and efficient cleaning process can be achieved and extended machine downtimes can be avoided.