Reflow Oven Cleaning

During the soldering process, evaporated fluxes as well as gas emissions from solder paste are deposited onto the internal surfaces of the reflow oven.  An increased level of flux precipitate and gas emissions can lead to an unstable reflow profile as the desired peak temperature in each zone cannot be consistently reached.  Moreover, during  subsequent reflow processes, contaminants from gas emissions can be redeposited onto the next assembly.   

Therefore, regular cleaning of reflow ovens ensures the stability of the reflow process. For this application, ZESTRON offers aqueous-based MPC® maintenance cleaning agents.

In addition to their improved cleaning performance as compared to ordinary alcohols, these MPC® based products have no flash point.  Therefore, they can be directly applied to warm surfaces.  Due to a short soaking time, a quick and efficient cleaning process can be achieved and extended machine downtimes can be avoided.

Cleaning SMT Reflow Ovens

Aqueous Based Reflow Oven Cleaning Agents

Cleaning agent options for reflow oven applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements. 

For easy and fast dispensing in reflow oven and wave solder system cleaning applications

Water-based cleaning agent for reflow and wave solder ovens

Water-based cleaning agent for reflow ovens and wave solder systems


Bath monitoring
Cleaner regeneration
FAST® Technology
HYDRON® Technology
Low standoff
Maintenance cleaning
Manual cleaning
Metal cleaning
MPC® Technology
PH neutral
Power Electronics
For sensitive surfaces
Spray bottle
Stencils & Screens
Surface Analysis
Underside wiping