Wave Solder Machine Cleaning

During the wave soldering process, cross-contamination occurs when flux residue builds on the conveyor fingers.  The residue buildup traps dust particles and other contaminants and as a result, the transported boards are contaminated when these particles are transferred onto them.

Additionally, as flux residue buildup on the conveyor fingers increases, it may interfere with and prevent consistent soldering dip.  This can lead to poor soldering reliability. Thus, continued cleaning of the conveyor fingers is critical to ensure that solder pallets are properly guided over the wave.

In order to avoid cross-contamination issues, ZESTRON offers aqueous-based MPC® Cleaners. These maintenance cleaning agents have no flash point and therefore, unlike commonly used alcohols, can be applied to warm surfaces.  This prevents unnecessary machine downtime.  Furthermore, for conveyor finger cleaning, these cleaners can be used while the process is running.

Conveyor Fingers

Aqueous and Solvent Based Wave Solder Cleaning Agents

Cleaning agent options for wave solder applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.  

Water-based cleaning agent for reflow and wave solder ovens

Water-based cleaning agent for reflow ovens and wave solder systems


Bath monitoring
Cleaner regeneration
FAST® Technology
HYDRON® Technology
Low standoff
Maintenance cleaning
Manual cleaning
Metal cleaning
MPC® Technology
PH neutral
Power Electronics
For sensitive surfaces
Spray bottle
Stencils & Screens
Surface Analysis
Underside wiping