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Process Control Products

PCB Assembly Defluxing and Cleaning Process

For Optimal Coating and Bonding Results

When cleaning assemblies (PCB cleaning, PCBA cleaning), the primary goal is to remove resin and flux residues from populated boards and hybrids as well as production related residues created by handling.

Even though in many low-end production processes the use of "no-clean" works well, high-end assemblies that will be employed in industries such as automotive, telecommunications, military, and aerospace, require the use of a specific PCB cleaning agent.

The targeted use of a PCB cleaning agent substantially affects all subsequent process steps such as wire bonding and conformal coating since it primarily removes the resin and activator residues.  If left on the assemblies, residues can cause the improper adhesion of bonds which can lead to failures such as heel cracks or lift-offs.  During the coating process, remaining residues can result in poor wettability and the delamination of the conformal coating which is known to cause  assembly failures, i.e. in-field failures.

flux untouched
flux partially removed
flux mostly removed
flux completely removed

There is an increased risk when using lead-free solder pastes as they contain more resins as well as aggressive activator systems.

When employing modern PCB cleaning agents, these problems can be avoided as they are able to remove most current flux residues. ZESTRON’s cleaning agents can be used in aqueous as well as semi-aqueous and water-free cleaning processes.

For cleaning lead-free as well as leaded assemblies, various cleaning machines and process types are available.

Water and Solvent Based PCB Cleaning Agents

Cleaning agent options for PCB cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.

Water-based cleaning medium for defluxing

Water-based cleaning medium for defluxing applications in spray-in-air processes

Water-based cleaning medium for flux removal

Water-based cleaning medium for defluxing

Water-based cleaning medium for flux removal

Water-based defluxing agent for high pressure cleaning processes

Water-based defluxing agent for low and/or medium pressure cleaning processes

Precision cleaning medium for manual flux removal

Water-based, pH neutral defluxing agent for spray-in-air cleaning processes

Water-based, pH neutral defluxing agent for spray-in-air low standoff applications

Water-based, pH neutral defluxing agent designed for PCB assemblies with low-standoff components

Alkaline defluxing agent for PCBs and Power Electronics

Water-based cleaning medium for flux removal

Solvent-based medium for PCB flux removal

Solvent-based cleaning medium for defluxing


Bath monitoring
Cleaner regeneration
FAST® Technology
HYDRON® Technology
Low standoff
Maintenance cleaning
Manual cleaning
Metal cleaning
MPC® Technology
PH neutral
Power Electronics
For sensitive surfaces
Spray bottle
Stencils & Screens
Surface Analysis
Underside wiping