Automated Stencil Cleaning

Automated stencil cleaning is the preferred method to ensure that the cleaning results are always reproducible as compared with a manual cleaning process. Manual cleaning can cause mechanical damage and soften the stencil epoxy over time resulting in possible delamination issues.

IPC standard (IPC 7526), recommends the use of an automated cleaning system in order to meet all production requirements.

There are numerous processes available for stencil cleaning including spray and ultrasonic dip tank processes. Depending on the type, these can be used with solvent and aqueous-based cleaners. These cleaning machines can be further differentiated by the number of chambers that are available for the various process steps such as cleaning, rinsing and drying. This enables the cleaning process to take place in one or more chambers. Steel stencils, fine pitch and nano-coated stencils as well as screens are commonly cleaned in these machines.

When cleaning pump print stencils, one should pay particular attention to the correlation between the aperture thickness and size. Compared to typical SMT stencils, pump print stencils require longer cleaning cycles.

ZESTRON offers aqueous-based MPC® cleaners as well as solvent-based cleaners.  Our stencil cleaning agents as well as the cleaning equipment provided by internationally leading manufacturers can be tested under production floor conditions in our Technical Center. 

Stencil Cleaning

Aqueous and Solvent Based Automated Stencil Cleaning Agents

Cleaning agent options for automated stencil cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.

Water-based stencil cleaner for the removal of solder pastes and SMT adhesives

Water-based stencil and PCB cleaner for the removal of solder pastes, SMT adhesives and fluxes

Water-based stencil cleaner for removal of solder pastes and SMT adhesives

Water-based cleaning agent for SMT stencil printer underside wipe systems

Polyester Nonwoven Cleanroom Wiper designed for manual removal of solder pastes and adhesives

Solvent-based cleaning medium for SMT stencils and screens

Cleaning medium for the removal of solder pastes, SMT adhesives and thick film pastes from stencils and screens

Solvent-based cleaning medium for SMT stencil printer wipe systems


Bath monitoring
Cleaner regeneration
FAST® Technology
HYDRON® Technology
Low standoff
Maintenance cleaning
Manual cleaning
Metal cleaning
MPC® Technology
PH neutral
Power Electronics
For sensitive surfaces
Spray bottle
Stencils & Screens
Surface Analysis
Underside wiping