Misprint Cleaning

Even though cleaning stencils can substantially improve the print results, misprints can still occur during the production process. When cleaning misprints, you are primarily removing solder paste that was inaccurately applied during the printing process.

When cleaning double-sided misprints, not only are misprinted solder pastes removed but also flux residues from the soldered side as well. Activator residues remaining on the board due to an inadequate cleaning process can cause improper assembly and field failures.

For stencil and misprint cleaning applications, ZESTRON offers aqueous-based MPC® as well as modern solvent-based cleaners that can be used for removing solder pastes and flux residues.  Our engineered cleaning agents as well as the respective cleaning equipment provided by leading international manufacturers can be tested at a ZESTRON Technical Center under production floor conditions.

Stencil Misprint Cleaning

Aqueous and Solvent Based Misprint Cleaning Agents

Cleaning agent options for misprint cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.  


Water-based stencil cleaner for the removal of solder pastes and SMT adhesives

Water-based stencil and PCB cleaner for the removal of solder pastes, SMT adhesives and fluxes

Water-based stencil cleaner for removal of solder pastes and SMT adhesives

Polyester Nonwoven Cleanroom Wiper designed for manual removal of solder pastes and adhesives

Solvent-based cleaning medium for SMT stencils and screens

Cleaning medium for the removal of solder pastes, SMT adhesives and thick film pastes from stencils and screens


Bath monitoring
Cleaner regeneration
FAST® Technology
HYDRON® Technology
Low standoff
Maintenance cleaning
Manual cleaning
Metal cleaning
MPC® Technology
PH neutral
Power Electronics
For sensitive surfaces
Spray bottle
Stencils & Screens
Surface Analysis
Underside wiping