Even though cleaning stencils can substantially improve the print results, misprints can still occur during the production process. When cleaning misprints, you are primarily removing solder paste that was inaccurately applied during the printing process.

When cleaning double-sided misprints, not only are misprinted solder pastes removed but also flux residues from the soldered side as well. Activator residues remaining on the board due to an inadequate cleaning process can cause improper assembly and field failures.

For stencil and misprint cleaning applications, ZESTRON offers aqueous-based MPC® as well as modern solvent-based cleaners that can be used for removing solder pastes and flux residues.  Our engineered cleaning agents as well as the respective cleaning equipment provided by leading international manufacturers can be tested at a ZESTRON Technical Center under production floor conditions.