Manassas, VA – March 14, 2018 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Jigar Patel, M.S.Ch.E., Senior Application Engineer, will present “PCB Reliability with QFNs and No Clean Fluxes” at the Soldering, Cleaning and Coating Workshop, on April 17th in Vancouver, Canada.
This is a free collaborative cleaning workshop with Arbell, Alpha Assembly Solutions, Aqueous Technologies, and MG Chemicals will be held at the Hard Rock Casino, 2080 United Blvd, Coquitlam, BC V3K 6W3, Canada. Visit ZESTRON Academy for the full agenda, or register for the event, by clicking here.
Jigar’s presentation will focus on potential reliability issues with the use of No Clean solder paste and flux. Trends within the electronics industry are increasingly moving towards miniaturized components, increased board density and reduced standoff heights, driving the need for precision cleaning regardless of paste types. For high reliability applications, cleaning is a requirement in order to prevent critical failure mechanisms. This presentation discusses the need to clean No Clean paste and fluxes and will review a case study validating cleaning process parameters needed for cleaning underneath Bottom Termination Components (QFNs).