Water-based cleaning agent for reflow and wave solder ovens

VIGON® RC 101, based on MPC® (Micro Phase Cleaning) Technology, was specifically developed to remove all types of baked-on flux residues from reflow and wave solder ovens. It reliably removes re-condensed fluxes from assemblies.

Advantages compared to other surfactant cleaners:

  • It has a mild formulation with a low alkaline pH value. No special labeling is required
  • Excellent material compatibility with aluminum and epoxy surfaces
  • Suitable for pre-cleaning of condensation traps
  • Has no flash point and therefore can be directly applied to cold or warm surfaces (30-40°C/86-104°F)
  • The medium does not contain any ingredients that could leave residues on the oven surfaces
  • This avoids harmful condensation on assembly surfaces after restarts
  • Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided

Advantages - Conveyor fingers cleaning:

  • Reduced cleaning agent consumption compared to IPA
  • No flashpoint formulation significantly increases the operator’s safety



  • Baked-on fluxes
  • Flux residues