VIGON® RC 101, based on MPC® (Micro Phase Cleaning) Technology, was specifically developed to remove all types of baked-on flux residues from reflow and wave solder ovens. It reliably removes re-condensed fluxes from assemblies.
Advantages compared to other surfactant cleaners:
- It has a mild formulation with a low alkaline pH value. No special labeling is required
- Excellent material compatibility with aluminum and epoxy surfaces
- Suitable for pre-cleaning of condensation traps
- Has no flash point and therefore can be directly applied to cold or warm surfaces (30-40°C/86-104°F)
- The medium does not contain any ingredients that could leave residues on the oven surfaces
- This avoids harmful condensation on assembly surfaces after restarts
- Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided
Advantages - Conveyor fingers cleaning:
- Reduced cleaning agent consumption compared to IPA
- No flashpoint formulation significantly increases the operator’s safety
