VIGON® SC 210

Aqueous-based stencil cleaner for removal of solder pastes and SMT adhesives

VIGON® SC 210, based on the MPC® Technology, is an aqueous-based cleaning agent specifically developed to clean SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives in a single process and provides excellent cleaning results, even at low temperatures. VIGON® SC 210 is designed to be used in spray-in-air and ultrasonic cleaning systems.

Advantages compared to other surfactant cleaners:

  • Consistently good cleaning results at temperatures between 18-40°C/64-104°F
  • High bath loading capability providing extended bath life and reduced cleaning agent costs
  • Aqueous-based, surfactant-free cleaner; leaves no residues on substrates or inside the equipment
  • Excellent material compatibility
  • No flash point and thus, can be used without explosion-proof protection
  • Non-foaming when used in spray-in-air and ultrasonic systems
  • Halogen free
  • Low odor

VIGON® SC 210

Area of Specific Application

Process

Contamination

  • Solder paste (unsoldered)
  • SMT or conductive adhesives
  • Water soluble flux residues