Post solder flux residues remaining on electronic assembly surfaces can adversely affect their functional reliability as a result of electrochemical migration, dendritic growth and leakage current. Thus, it is critical to remove these residues in order to ensure the highest level of product reliability. One method of assessing substrate surface cleanliness is visual inspection analysis. This is a non-destructive cleanliness assessment method defined within IPC standards.
Utilizing state of the art high resolution microscopes, ZESTRON Application Engineers can conduct visual inspection analysis at our Technical Centers per the latest IPC standards. Whether you are cleaning boards at your facility and sending them to ZESTRON for surface analysis, or taking advantage of the numerous cleaning processes available to you at our Technical Centers, visual inspection analysis can be completed easily and quickly providing you with valuable insight regarding the effectiveness your precision cleaning process.
This service is performed at a ZESTRON Technical Center and includes:
Please complete a Service Request Form to request a Visual Inspection service.