Process Optimization

Any modification in a manufacturing process such as introduction of a new solder paste, adding a new product, or change in soldering profile, will result in possible cleaning process changes.  Any process change requires a detailed review or optimization in order to guarantee that the required level of cleanliness is achieved.  By conducting substrate cleanliness assessments at our Technical Center and/or detailed process review at your location, our Application Engineers will redefine and document all cleaning process operating parameters to ensure your cleaning requirements are achieved.


  • PCB cleanliness assessment according to current IPC standards
  • Comprehensive cleaning process assessment and optimization conducted by a ZESTRON Application Engineer
  • Peripheral device inspection, evaluation and recommendations provided

Please complete a Support Request Form for more information on optimizing your process.

Process Optimization

Process Optimization Request

Technical Information Request

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