for professionals. by professionals.2023 Webinar Series
ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series. All webinars have a 45 minute presentation and 15 minute Q&A. If there is a specific cleaning topic you are interested in, please visit our customized training page.
Join ZESTRON Academy for an informative and collaborative discussion on cleaning agent technologies and process alternatives to DI-water. Increased assembly density, reduced component sizes, low standoff heights, and a large variety of component packages limit the effectiveness of cleaning with DI-water. This webinar will review case studies and discuss key performance indicators, including cleanliness, material compatibility, power requirements, and DI-water usage.
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Meeting Today’s Challenge for Low VOC Defluxing Agents in Electronics Manufacturing
April 20, 2023, 2:00 PM EST
Dr. Terry Price discusses the latest industry trends toward selecting safer products. Corporate environmental sensitivity is critical to the stakeholders and, for many, is grounded in ISO 14001. This webinar will review the pros and cons of different development technologies employed to produce forth green, safe, and effective aqueous-based defluxing agents.
Concentration Monitoring – From Manual to Automatic: A Collaborative Discussion with Sr. Application Engineer, Naveen Ravindran
May 11, 2023, 2:00 PM EST
Maintaining your wash bath target concentration is essential to ensure that the highest cleanliness levels are achieved for critical electronics in high-reliability applications. Join ZESTRON Academy for a review of manual and automated concentration monitoring methodologies, the benefits and limitations of each, and the importance of consistent concentration management in your process. Are you consistently monitoring wash bath concentration? Looking for a more efficient process but unsure of options? Join us for the 30-minute collaborative discussion following the short technical presentation.
DI-Water Cleaning: The Good, The Bad and The Better – A Collaborative Discussion with Sr. Application Engineer, Jigar Patel
June 8, 2023, 2:00 PM EST
An informative and collaborative discussion on cleaning agent technologies and process alternatives to DI-water. Increased assembly density, reduced component sizes, low standoff heights, and a large variety of component packages limit the effectiveness of cleaning with DI-water. This webinar will review case studies and discuss key performance indicators, including cleanliness, material compatibility, power requirements, and DI-water usage. Is your DI-water process meeting your cleaning requirements? Need tips to improve the cleaning process’s effectiveness and efficiency? Join us for the 30-minute collaborative discussion following the short technical presentation.
Cleaning Before Conformal Coating Case Studies - A Live Question & Answer Session with Specialty Coating Systems
September 14, 2023, 2:00 PM EST
Join ZESTRON Academy and Specialty Coating Systems for an informative discussion on the criticality of cleaning PCBs prior to conformal coating. We will discuss and answer questions regarding the benefits of cleaning PCBs, the deleterious effects of coating over residues, cleanliness assessment methods used before conformal coating, and the test methods used to assess reliability afterward. Specialty Coating Systems, the Parylene coating experts, will share and discuss process recommendations to ensure that your products perform as expected over the long term. Are you considering implementing a coating process? Do you have questions on coating-related failures? Join us for the 30-minute question and answer session following the short technical presentation.
Cleaning Performance Evaluations and Best Practices for Novel Jettable Pastes for Advanced SMT Assembly Processes – Featuring Evan Griffith from Indium Corporation
October 19, 2023, 2:00 PM EST
Join ZESTRON Academy and Evan Griffith from Indium Corporation in a detailed discussion regarding the increased popularity of solder paste jetting. The advantages of solder paste jetting will be examined as well as an analysis of the cleaning compatibility of both jetting and printing solder pastes. This webinar will provide an in-depth look at the entire process, from assembly and cleaning to visual inspection according to IPC standards.
Risk Assessment of NMe Particles and Fibers/ HV NMe Particle Behavior – ZESTRON Europe: Reliability and Surfaces Team
November 7, 2023, 8:30 AM EST
More information to come!
Advanced Packaging and Power Electronics:A Webinar Series on the Latest Innovations, Cleaning, and Corrosion Challenges
ZESTRON Academy is proud to present the Advanced Packaging and Power Electronics webinar series! This is a free educational opportunity providing valuable knowledge on the latest advancements and trends within the Advanced Packaging and Power Electronics sector. This series is an excellent way to stay up-to-date and enhance your understanding of semiconductor materials, processes, and equipment.
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Enhancing Performance of Copper Pillar Interconnects through Defluxing
June 15, 2023, 2:00 PM EST
Copper pillar bumping is a popular method used to create interconnects on flip chips, wherein copper pillars are used instead of traditional solder bumps. During the bumping process, a layer of flux is coated on the surface of the copper pillars to promote the wetting and bonding of the pillars to the substrate.
Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, will be presenting this topic, focusing specifically on the effectiveness of pure DI-water and comparing its cleaning performance to novel low-concentration cleaning agent in removing these flux residues from 150µm bump pitch and 30µm Cu pillar height. Ravi will provide an in-depth analysis of the comparative assessment performed utilizing several analytical/functional test methodologies based on the latest IPC and JEDEC standards.
Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs
July 20, 2023, 2:00 PM EST
Defluxing ultra-fine pitch die on chip-on-wafer (CoW) packages is a critical step in the manufacturing process of microelectronics. However, defluxing these ultra-fine pitch die interconnects presents a unique challenge due to their small size and close proximity to one another.
Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, will be presenting a continuation of the previous copper pillar study focusing on the defluxing process for ultra-fine pitch die on chip-on-wafer (CoW) packages. Specifically, the study will investigate the appropriate cleaning solution and process parameters, such as temperature, concentration, and cleaning time, required to effectively remove the flux residues without damaging the delicate interconnects on CoW packages with a 10µm bump pitch and 10µm gap height between a top die and bottom silicon wafer. The results of this study will provide valuable insights into the defluxing process, enabling the production of high-quality microelectronics with improved reliability and performance.
Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components
August 17, 2023, 2:00 PM EST
Flux residues are a common challenge in cleaning power electronics components. These residues can cause corrosion, electrical shorts, and other reliability issues, affecting the performance and longevity of the components. It is important to follow best practices for cleaning power electronics components to address this challenge.
Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, will be providing an overview of the evolution of power electronics as well as going over the details of selecting the appropriate cleaning method, ensuring compatibility with the components, and validating the cleaning effectiveness. Ravi will also go over the several test methods that can be effectively used to validate the cleanliness of power electronics components. Through a series of case studies, we will look at complex component packages and what it takes to clean them successfully.
Corrosion in Power Electronics – ZESTRON Europe; Reliability and Surfaces Team
September 21, 2023, 2:00 PM EST
Join ZESTRON Academy’s Stefan Strixner, ZESTRON Europe Principal Engineer & Technology Analyst, and Ravi Parthasarathy, Senior Application Engineer, to discuss how failures induced by corrosion mechanisms, such as electrochemical migration (ECM), are a growing challenge for power electronics manufacturers. The team will detail how these failures occur in practice, the cause and roles that materials and humidity play, and the strategies to avoid and/or remedy ECM and the anodic migration phenomenon (AMP).