VIGON® UC 160
Water-based cleaning agent designed for SMT stencil printer underside wipe systems
Your Benefits VIGON® UC 160
A water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printers increasing number of prints between cleaning cycles
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Ideal cleaner for leaded and lead-free paste
Ideal for cleaning leaded and lead free solder paste from fine pitch stencil apertures during stencil underside wipe applications -
Low evaporative losses and effective wettability
With low evaporative losses and effective wettability, product consumption is minimized and wipe cycles are reduced for optimal line operation. -
Excellent material compatibility
Aqueous-based, surfactant-free cleaner with excellent material compatibility on all wetted parts (stencils & printers)
Product features
Underside wiping
MPC® Technology
PH neutral