VIGON® UC 160

Your Benefits VIGON® UC 160

A water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printers increasing number of prints between cleaning cycles

• Ideal cleaner for leaded and lead-free paste
  Ideal for cleaning leaded and lead free solder paste from fine pitch stencil apertures during stencil underside wipe applications
• Low evaporative losses and effective wettability
  With low evaporative losses and effective wettability, product consumption is minimized and wipe cycles are reduced for optimal line operation.
• Excellent material compatibility
  Aqueous-based, surfactant-free cleaner with excellent material compatibility on all wetted parts (stencils & printers)