ZESTRON® FA+

Your Benefits ZESTRON® FA+

A solvent-based cleaning agent designed to remove all types of flux residues from electronic assemblies, ceramic hybrids, power electronics (power modules, leadframe-based discrete components, Power LEDs), and packages (Flip Chips/CMOS). It is surfactant-free and does not require explosion-proof precautions.

• Exceptional cleaning performance
  Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
• Extended Bath Life
  High bath loading capability results in long bath life and reduced process cost and downtime
• Easy rinsability
  Due to the surfactant-free formulation, it is easily rinsed
• Exceptional cleaning performance
  Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
• Ideal for subsequent processes
  Increases wire bonding/molding quality for power modules, leadframe-based discrete components and Power LEDs
• Multiple industry approvals
  EMPF Phase II tested and MIL approved and listed on the ESA ‘list of declared materials’