Defluxing of Copper Pillar Bump Flip Chips

Flip-chip technology has grown significantly in the electronics industry, driven by its cost-effectiveness, heightened package density, improved performance and the simultaneous maintenance or improvement of circuit reliability and increased I/O density. Join ZESTRON Academy’s webinar session to study the recently presented study that focuses on straight DI-water and innovative low-concentration alkaline cleaning agents for cleaning of copper pillar bumped flip-chips as well as challenges for effective flux residues cleaning from beneath these components. Stay at the forefront of technological advancements by joining us in this informative webinar.