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Defluxing of Copper Pillar Bump Flip Chips

This webinar lets you study the recently presented study that focuses on straight DI-water and innovative low-concentration alkaline cleaning agents for cleaning copper pillar bumped flip-chips as well as challenges for effective flux residue cleaning from beneath these components.

Details

At a glance


Date

Fri, 27.09.2024 , 03:00PM-04:00PM MYT


Location

Online Webinar


Fee

Free of charge


Description

What you can expect

Flip-chip technology has grown significantly in the electronics industry, driven by its cost-effectiveness, heightened package density, improved performance and the simultaneous maintenance or improvement of circuit reliability and increased I/O density. Join ZESTRON Academy’s webinar session to study the recently presented study that focuses on straight DI-water and innovative low-concentration alkaline cleaning agents for cleaning of copper pillar bumped flip-chips as well as challenges for effective flux residues cleaning from beneath these components. Stay at the forefront of technological advancements by joining us in this informative webinar.

Online Webinar

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