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Enhancement of Solder Paste Printing Process Through Cleaning

This webinar gives you an in-depth review of the process-related challenges associated with solder paste and adhesive-contaminated stencils to deepen your understanding and optimize your production processes.

Details

At a glance


Date

Thu, 21.11.2024


Location

Webinar


Fee

Free of charge


Description

What you can expect

Attend ZESTRON Academy’s webinar for an in-depth review of the process-related challenges associated with paste and adhesive-contaminated stencils. Gain valuable insights into stencil cleaning technologies aimed to enhance solder paste printing processes. Our Cleaning Experts will explore the principles of the underside wipe process and provide a thorough overview of misprinted board cleaning within the context of today’s production environment. Don't miss this opportunity to deepen your understanding and optimize your production processes.

Online Webinar

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