Enhancement of Solder Paste Printing Process Through Cleaning

Attend ZESTRON Academy’s webinar for an in-depth review of the process-related challenges associated with paste and adhesive-contaminated stencils. Gain valuable insights into stencil cleaning technologies aimed to enhance solder paste printing processes. Our Cleaning Experts will explore the principles of the underside wipe process and provide a thorough overview of misprinted board cleaning within the context of today’s production environment. Don't miss this opportunity to deepen your understanding and optimize your production processes.