Determining Organic Solvent Bath Life In Lead-Frame Defluxing Application

High lead solder paste is used as the interconnect material between the DIE and the copper lead frame or copper clips in high-power discrete packages. Flux aids the soldering process as well as removing the oxidized metal formed on the surface of the solder alloy and lead-frame. After reflow soldering, the cleaning process is essential to remove flux residues from high power discrete packages, typically involving an organic solvent in a semi-aqueous cleaning process. The bath lifespan of the organic solvents is a key factor influencing the process costs and product quality. Flux loading, copper content, and water content in the organic solvent were chosen to study factors that impact the bath lifespan in the semi-aqueous centrifugal cleaning process. Join our webinar to evaluate the results from the findings correlated with the methods used.