Challenges and Influencing Factors of Semiconductor Packaging Reliability
This webinar discusses the related challenges and solutions to contamination affecting package reliability and failures.
Details
At a glance
Date
Fri, 03.04.2026
Location
Online-Webinar
Fee
Free of charge
Description
What you can expect
The importance of semiconductor package reliability depends on the manufacturing process, involving multiple stages from wafer fabrication to final testing. Contamination is one factor affecting package reliability and can lead to package failure. This webinar will explore the related challenges and solutions.
Online Webinar
Expertise