ICT testing challenges: the role of no-clean residues
In-circuit test failures arise from residues that increase contact resistance or hide pads. Residues can also trap ionic contaminants, causing false fails under bias. Mitigation:
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implement cleaning where ICT contact is frequent,
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add a brief solvent wipe before test,
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ensure residue spec limits are met at test points.
Document residue levels and correlate to ICT failure statistics.