Power Electronics PCB Leakage Risks
Power electronics operate at high voltages and currents, where contamination increases leakage currents, arcing, and insulation degradation. Even small ionic residues or conductive particles can create partial discharge sites under high electric fields, leading to catastrophic failures.
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leakage increases with ionic contamination and humidity
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particulates can create local field enhancement and tracking
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cleaning reduces dust and ionic residues to improve dielectric strength
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validation includes surface insulation resistance and leakage current tests
Understanding leakage mechanisms
Leakage occurs when conductive paths form across dielectric surfaces due to salts, acids, or moisture. Tracking and electrochemical migration accelerate under bias. Power modules require both surface cleanliness and robust coatings to prevent conductive bridges and corrosion.
Mitigation strategies for leakage risks
Mitigate leakage by specifying low-ion cleaning chemistries, thorough rinsing, and drying. Conformal coatings and plasma treatments improve hydrophobicity and adhesion. ZESTRON’s solutions include process chemistries and analytics to verify surface resistivity and ionic levels after cleaning.