Avoid Failures Before They Occur

Tailor-Made. Reliable. Experienced. - ZESTRON Reliability & Surfaces

AVOID FIELD FAILURESTechnology Coaching

Ionic or particulate contamination on the surface can cause electronic assemblies to malfunction. To minimise the risk of failure and ensure reliability, our experienced Reliability & Surfaces Team (R&S) offers customised technology coaching.

Electrochemical migration, leakage current or a short circuit are typical failure mechanisms. Within the scope of technology coaching, our R&S team advises and supports you on how to avoid failures and produce reliable, moisture-resistant assemblies - along the entire value chain.

Electronic assemblies Surface cleanliness Analysis | © @The Sour Cherry Fotografie - Michaela Curtis

YOUR ADVANTAGESAvoid Failures and Produce Reliable Assemblies

1.  Preventive assessment of the risk of default before production starts

2.  Analysis of failures during validation tests

3.  Cause analysis in case of damage in the field

 

SOLUTION-ORIENTEDDriven by Reliability

On the way to solving your challenge, the first step is to identify the (potential) failure mechanism. To do this, we use a wide range of analytical methods such as SEM/EDX, ion chromatography or fracture stress analysis. We put the results into the overall context of your problem and then work out feasible measures to solve it.

Electronic assemblies Surface cleanliness Causes Analysis | © @The Sour Cherry Fotografie - Michaela Curtis

Technology coachingReliability is No Coincidence - Benefit From our Technology Coaching
 

Everything From a Single Source
Analysis, interpretation and remedial action

Tailor-Made
Analyses and solutions tailored to your challenge

Discretion
Signing of an NDA on request

Speed
Max. 5 weeks processing time from placing of order and receipt of the objects of investigation

Many Years of Success
Continuously updated in research projects and studies


TECHNOLOGY COACHING PACKAGESEmpowering Solutions: Explore Our Specialized Technology Coaching

Every challenge is individual. But our experience shows that some problems occur more frequently than others. In order to be able to help you even faster and in a more targeted manner, we have therefore put together packages with the appropriate analyses.

Analysis of purity determination of electronic assemblies | © @The Sour Cherry Fotografie - Michaela Curtis

Risk Assessment of Particles on Electronic Assemblies

We check the safety of your assembly with regard to short circuits and impairment of insulation coordination triggered by conductive particles.

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Ionic contamination measurement IC | © @The Sour Cherry Fotografie - Michaela Curtis

Control of Processed Solder Pastes and Fluxes on Electronic Assemblies

We analyse whether the fluxes used comply with the specifications, especially with regard to ROL0 requirements and required tracking resistance/paintability.

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Electronic assemblies Damage analysis Corrosion | © @The Sour Cherry Fotografie - Michaela Curtis

Conformal Coating: Validation and Routine Testing

The protective effect of the coating against electrochemical migration, leakage current and corrosion is verified by means of tests.

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PCB protective coating validation routine testing | © @The Sour Cherry Fotografie - Michaela Curtis

Risk Assessment of Leakage Currents and Condensation

We determine the hygroscopicity and corrosivity of ionic impurities and thus the risk of leakage currents and condensation.

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WE GO TROUBLESHOOTING FOR YOURequest Now Without Obligation

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