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TOP ArticleIncreasing Yield and Reliability of Sintered Single- and Double-Sided Cooled Packages

A cooperation of MacDermid Alpha and ZESTRON

Sintering and molding are key in power module production, but mold delamination can lead to issues. This study explores surface improvements for single- and double-sided modules using various cleaning solutions.

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The picture shows a white paper that deals with the causes and remedial measures for residues on electronic assemblies. | © Zestron

[PCB Cleaning]

Residues on PCBAs - Causes and Remedial Measures

Recommendation

[PCB Cleaning]

Cleaning of Electronic Assemblies Prior to Conformal Coating

recommendation

[PCB Cleaning]

Cleaning of Electronic Assemblies Prior to Conformal Coating - Part 2


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Whitepaper-collectionTechnical Articles for Reliable Electronics

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