Power Electronics – Robust and Reliable
How precise surface analysis and modification form the foundation for robust bonding processes and maximum yield.
Power electronicsEfficient Analysis and Optimization for Improved Surface Properties
In the production of high-quality power modules, yield is a critical cost factor. However, the numerous material interfaces within the manufacturing chain are exposed to significant thermomechanical stress. The various component surfaces are often difficult to specify and subject to tolerances as well as process-related influences. This can negatively affect yield, quality, and cost efficiency.
We support you with high-precision analytics and innovative wet-chemical surface modification to identify and optimize the key surface characteristics that impact your processes.
assembly & interconnection technology Understanding and Solving Surface Interface Challenges
Soldering, sintering, molding, bonding, and silicone encapsulation are key processes in power module manufacturing. Every stage—from die attach and die top to terminal bonding, heat sink integration, and transfer molding—requires precisely tuned surface properties to ensure the highest quality and long-term reliability.
ZESTRON supports you in overcoming the specific challenges at material interfaces. Through targeted analysis and, where necessary, surface modification, we help optimize yield and ensure the long-term reliability of your modules.
surface & failure analysisPrecise Analytics and Case-Specific Interpretation for Stable Processes
Every interconnection process has specific requirements for surface properties. If these are not met, process disruptions, quality issues, and scrap—such as mold delamination—or even field failures can occur. The result: unnecessary costs and production delays.
Using advanced techniques like SEM/EDX and other state-of-the-art analytical methods, we examine the surfaces of your components and provide case-specific interpretations of the results—aiming to enhance the quality of your processes. In the event of power module failures, we quickly identify the root cause and work with you to develop effective corrective actions. Our extensive experience ensures fast and targeted solutions.