Contact Angle Measurement

Analytical servicesContact Angle Measurement

In contact angle measurement, defined drops of test liquids are placed on a surface. In power electronics, such surfaces can include polymers of electronic assemblies or metal substrates. The angle formed between the edge of the drop and the surface is the contact angle θ.

This method provides insight into surface wettability, a key factor for the quality and reliability of subsequent processes such as bonding, sintering, molding, and coating.

Correct interpretation of contact angles in the customer’s specific context helps prevent issues like poor wettability or mold adhesion, reducing rejects, complaints, and long-term field problems.
 

When is a contact angle measurement useful?

• Contact angle measurement as a convincing method for complete evaluation of wettability, solderability and surface quality of your electronic assemblies and power electronics devices

• During process development contact angle measurements help identifying the optimal cleaning agent to obtain suitable wettability for subsequent processes such as soldering, bonding or coating

• Objective quality control of surfaces before subsequent processes

• Preventing costly subsequent errors such as wettability or mold adhesion problems leading to rejects, rework, complaints or reduced component life

• Results can be used as basis for defining internal quality standards

We offer:

• Precise determination of the polar and dispersive components of surface energy (±0.1 mN/m)

• Polar and dispersive components for optimal matching to specific molding, underfill, coating

• You will receive results quickly via email

• Results can be used as basis for defining internal quality standards

• Umfangreiches Expertenwissen im Bereich Elektronikfertigung