Risk Assessment & Failure Evaluation
Comprehensive solutions from root cause analysis to implementation – ensuring greater reliability, lower consequential costs, and secured supply capability.
Risk assessment & Failure assistanceExpert Solutions for Failure Analysis and Sustainable Quality Assurance
From root cause analysis and 8D reports to Technical Cleanliness and process optimization — we help you in identifying weak points at an early stage and implementing targeted improvement actions. Our specialized solutions ensure the quality of your products while reducing legal and financial risks. At the same time, we support compliance with relevant standards and provide long-term security for your electronics manufacturing.
We investigate failure mechanisms (cause) and identify the underlying root cause to enable sustainable corrective actions. Our targeted support in change management ensures long-term solutions for:
- Validation failures in the PPAP process (DV, PV), especially after climate stress tests according to IEC 60068-2, VW 80000, BMW and Mercedes factory standards
- Dendrite formation (ECM, AMP, partial discharge, creepage corrosion, whiskers)
- Discoloration (corrosion, oxidation, contamination, polymer degradation)
We provide extensive support in preparing 8D reports in order to minimize legal and financial risks while securing supply capability. Our expertise specifically assists with:
- Out-of-court settlements and arbitration decisions
- Claim defense and contract compliance
- Prevention of indirect financial losses (e.g., bank ratings, financial reserves)
- Securing supply capability
We support you in implementing measures to ensure Technical Cleanliness (TecSa) and insulation coordination:
- Implementation support for VDA 19, ZVEI guidelines and IEC TR 61191-7
- Room planning, equipment concepts, audits, risk assessments and training
- TecSa management from strategy and concept development to operational implementation
- Development of a robust Component Cleanliness Code for drawings and specifications to ensure compliance with the agreed level of contamination according to IEC 60664-1 and IPC 2221
We help you to identify weak points in process development at an early stage and to minimize risks effectively to ensure the quality of your products:
- Analysis of product and prototype weaknesses using rapid quality testing methods
- Support with A/B samples
- Advice on and optimization of coating, potting, molding and embedding processes
- Support with sintering processes
Structured Approach to Success
With a clear and structured process, we identify risks, assess root causes, and develop targeted solutions — thorough, confidential, and practice-oriented.
Evaluation
In a non-binding initial consultation, we evaluate your challenge, ask specific questions, and discuss how we can best support you.
Confidentiality
Our approach is always systematic and confidential. After signing a non-disclosure agreement (NDA), we plan targeted analysis and tests to precisely identify failure mechanisms. Based on that, we then prepare an individual quotation.
Interpretation
We analyze your data in order to precisely pinpoint the failure mechanism within the system context. Together, we evaluate risks and probabilities of occurrence in order to establish a solid foundation for the next steps.
Recommendation
We develop measures for failure resolution and risk minimization, tailored to technical feasibility and cost efficiency. Each solution is evaluated in the system context and optimally aligned with your requirements. In addition to analysis results, you receive clear actionable recommendations.
practical insightsSolutions for Your Challenge
The reliability of assembled PCBs and power electronics is essential for minimizing scrap and rework. Our case studies and application examples demonstrate how we precisely analyze failure causes, implement practical solutions and sustainably optimize production processes to successfully overcome technical challenges.

Your Challenge: Defining the Righte Pollution Degree
Pollution Degree: Influencing Factors and Implementation in the Supply Chain and Manufacturing

Corrosion and (Green) Discoloration on Electronic Assemblies
Identifying Issues and Developing Sustainable Solutions to Protect Assembled PCBs.

Dendrites, Creepage Distances, and Deposits on Electronic Assemblies – All Consequences of Electrochemical Migration?
An overview of dendritic failure mechanisms and their associated failure patterns, illustrated through practical examples.

VDA 19: Technical Cleanliness – The Key to Preventing Particle-Induced Failures
How innovative cleanliness concepts based on VDA 19 ensure the reliability of electronic components.
PartnershipsOur Collaborations Strengthen Our Expertise
With our extensive network of experienced industry partners, we leverage additional expertise to provide you with tailored solutions.