Targeted Surface & Failure Analysis

ZESTRON supports you with the analysis and interpretation of your surfaces and modules at every stage of their lifecycle.

Surface Analysis Your Advantage in Development, Production, and Field Applications

SEM/EDX, FTIR spectroscopy, and ion chromatography (IC) are just a few of the high-quality analytical methods we apply in the field of power electronics. The true value for you, however, lies not in the measurement itself, but in the targeted planning of the analysis and the in-depth, case-specific interpretation of the results.

Our experts have extensive experience in analyzing and interpreting surfaces in power electronics. They conduct targeted surface investigations with a focus on specific assembly and interconnection processes – in development, production, and in the event of field failures – to accurately identify the root causes.

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surface analysisUnderstanding Surfaces Is the First Step to Success

The quality of your power module processes starts at the surface. Every material interface presents unique challenges. By understanding surfaces, we can decipher the underlying functional mechanisms, enabling us to develop methods for surface adaptation and targeted process optimization.

Using high-precision techniques such as SEM/EDX, FTIR, IC, and other advanced methods, we uncover and evaluate the characteristics of your surfaces. Whether it’s surface properties, metallization, finishes, or adhesion issues—our analysis provides the answers you need to take your interconnection processes to the next level.


 

Are you interested in analyzing the surface properties of your components?

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Surface analysis of a halfbridge power module with Keyence microscope | © @The Sour Cherry Fotografie - Michaela Curtis

On peut voir une surface de circuit imprimé ENIG (Electroless Nickel Immersion Gold) avec de la corrosion. | © Zestron
SEM/EDX: Nickel corrosion in the ENIG layer

because what may not be, can still happenWhen Failure Strikes, We Identify the Cause and Provide a Solution

If your power module fails during validation or later in the field, our team of experts helps uncover the root causes.

Using electrical methods such as impedance spectroscopy and advanced optical and electron-optical analyses like SEM/EDX, we detect surface defects and identify the reasons for failure at a microscopic level.

Once the cause is determined, our experts develop actionable recommendations and, if desired, support you throughout the implementation process.

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Power electronicsGain Clarity with High-Precision Surface Analysis

Ensure process stability, reduce failure risks, and validate your assumptions with expert-backed analysis. Our team will guide you through every step.

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