Failure Assistance and Risk Assessment for SMT Electronic Assemblies
When electronic assemblies fail, do not pass qualification tests or process risks need to be assessed before series release, ZESTRON supports you with technical evaluation. We analyze failure patterns, assess relevant influencing factors and derive concrete corrective actions for quality assurance, delivery capability and process assurance.
UNDERSTAND FAILURES AND DERIVE CORRECTIVE ACTIONS When SMT Electronic Assemblies Fail or Process Risks Become Visible
Field failures, customer complaints or failed qualification tests require a fast and traceable technical evaluation. At the same time, potential risks caused by residues, particles, humidity, material changes or process deviations must be identified at an early stage before they become critical in series production.
With experience from more than 800 failure cases, ZESTRON supports manufacturers of electronic assemblies in narrowing down causes, assessing technical risks and deriving suitable corrective actions.
✓ Narrow Down Failure Causes
✓ Assess Influencing Factors
✓ Derive Corrective Actions
FAILURE ASSISTANCE FOR SMT ELECTRONIC ASSEMBLIES When Electrical Failures or Failed Qualification Tests Require Fast Decisions
Field returns, electrical failures or failed qualification tests on SMT electronic assemblies require a fast and traceable technical evaluation. ZESTRON supports you in narrowing down the actual failure causes of your electronic assemblies, assessing relevant influencing factors and deriving concrete corrective actions.
We do not only consider the electronic assembly itself, but also potential causes in the SMT process, the material system, the design or the supply chain. Especially in the context of automotive requirements, for example during the C-sample phase, a neutral technical evaluation can be decisive for reliably supporting customer requirements, supplier discussions and further next steps.
You receive a confidential evaluation of your failure case as well as concrete recommendations for short-term damage limitation and long-term technical assurance. The evaluation is carried out in accordance with high information security requirements based on ISO/IEC 27001 and TISAX®.
from practiceReliable Support in Failure Cases
Corrosion, discoloration, dendrites or creepage paths are visible indicators of possible electrical or material-related failure mechanisms. The decisive factor is the technical evaluation within the specific design of the electronic assembly, so that the actual cause can be narrowed down and suitable corrective actions can be derived.
Dendrites, Creepage Distances, and Deposits on Electronic Assemblies – All Consequences of Electrochemical Migration?
✓ Identify Risk Sources
✓ Assess Impacts
✓ Derive Specifications
RISK ASSESSMENT FOR SMT ELECTRONIC ASSEMBLIES Assess Process and Cleanliness Risks on SMT Electronic Assemblies at an Early Stage
Not every risk on SMT electronic assemblies becomes visible immediately as a failure. Particles, residues, humidity, small distances, material changes or process deviations may only become critical under stress and can lead to qualification problems, insulation failures or field failures.
A particular focus is placed on Technical Cleanliness. Critical particles on assembled printed circuit boards are not only counted, but evaluated within the specific design of the electronic assembly: relevant factors include their position, size, material properties, electrical distances and potential effects on creepage paths or insulation behavior.
Our assessments are based on extensive practical experience and established standards such as VDA 19.2, IPC-TR-1771 and IEC 60664. This enables us to identify critical areas, evaluate possible failure mechanisms and provide reliable data for cleanliness specifications, drawing requirements and quality-relevant decisions.
The result is a traceable basis for product qualification, PPAP, SOP, customer audits and improved delivery reliability through early prevention. The evaluation is carried out in accordance with high information security requirements based on ISO/IEC 27001 and TISAX®.
From practice Confidence Through Sound Risk Assessment
Experience from numerous projects shows what really matters when it comes to evaluating technical cleanliness, contamination levels, and process risks.
Assistance-ModulesFrom Technical Evaluation to Reliable Decisions
Our Assistance Modules support you when failure cases, qualification problems or process risks require a reliable technical evaluation. ZESTRON assesses causes and influencing factors and derives concrete measures for failure assistance, risk minimization and process assurance.
Facing Acute Challenges with Your SMT Assemblies? Have Your SMT Electronic Assembly Evaluated with Confidence
Whether you are facing a failure case, a qualification problem or a risk assessment, ZESTRON supports you with technical evaluation and the derivation of suitable next steps.