Whitepapers on Power Electronics
Technical insights into surface treatment, molation behavior in advanced power modules
Power ElectronicsEvaluating Surface Treatment and Interface Reliability
How does surface treatment influence mold adhesion in power modules? Which factors contribute to delamination? And how can different surface treatment strategies be assessed for double-sided cooled sintered power modules?
Reliable interfaces between materials are essential for robust power module designs. In double-sided cooled sintered power modules, the condition of the surfaces can influence adhesion to the molding material and the resulting delamination behavior.
The whitepapers in this category examine surface treatment strategies and their impact on critical interfaces in power modules. They provide technical insights into the evaluation of mold adhesion and delamination behavior and support the assessment of suitable approaches for advanced power module designs.