Whitepapers on Electrochemical Migration and Corrosion
Technical insights into failure mechanisms, influencing factors and protective measures for electronic assemblies.
Electrochemical MigrationUnderstanding Failure Mechanisms and Protective Measures
How does electrochemical migration develop on electronic assemblies? How can the movement of metal ions lead to metallic bridges? And which protective measures can help reduce the risk of malfunctions and failures?
Electrochemical migration can occur when metal ions move across a circuit board under an applied voltage. This process can result in metallic bridges that cause short circuits, malfunctions or failures in electronic assemblies.
The whitepapers in this category examine the origin and behaviour of electrochemical migration and provide insights into suitable protective measures. They support the technical assessment of ECM-related risks and help readers understand how these failure mechanisms can be prevented or reduced.