Investigation on Lead Flake Formation and Mitigation Strategies
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Whitepaper-collection Investigation on Lead Flake Formation and Mitigation Strategies
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[ZESTRON South Asia - Yeoh Guan Tatt and Zestron Europe - Dr Arkadius Maciollek]
ABSTRACT:
Lead (Pb) flakes, characterized by thin, greyish-silver particles, often occur around the solder joints, on the chip surface, or on bond pads during flux removal processes using high-temperature, high-lead solder. Their presence can negatively impact subsequent processes, such as wire bonding, molding, or packaging reliability, necessitating investigation into their formation mechanisms to develop mitigation or elimination strategies, ultimately improving production yield.
Detailed research was conducted to investigate the formation of lead (Pb) flakes during flux removal process. Using a range of analytical techniques, this research aims to understand the underlying mechanisms and chemical reactions influenced by the soldering process, flux reaction, cleaning agent, or cleaning process parameters that lead to flake formation, ultimately leading to the development of effective mitigation strategies.
The study explored several hypotheses regarding lead flake formation, validated using SEM & EDX analysis. This led to the identification of mitigation strategies, including optimization of soldering and cleaning processes aimed at reducing or eliminating lead flakes.
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