Influencing Factors in Determining the Bath Lifespan of Organic Solvents in Leadframe Cleaning Application

Whitepaper-collection Influencing Factors in Determining the Bath Lifespan of Organic Solvents in Leadframe Cleaning Application

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[Mr. GT Yeoh, Mr. CT Lok, Mr. Mohamad Husaini]

ABSTRACT: 

In the high power discrete packages, high lead solder paste is used as interconnection material between the DIE and copper lead-frame. Flux is part of the contents of high lead solder paste, it is used to assist the soldering process and remove the oxidized metals that formed on the solder alloys and leadframe surfaces during the soldering process. The cleaning process is indispensable after the reflow soldering to remove the flux residues from high power discrete packages and this de-fluxing application generally employs an organic solvent as the cleaning agent in the semi-aqueous cleaning process.

The bath lifespan of an organic solvent is crucial for a cleaning process as it highly influences the process cost and package quality. The authors had chosen the flux loading, copper and water content in the organic solvent as the main factors and study its impacts on the bath lifespan in a centrifugal cleaning process.

The analysis also performed to study the impact on the package quality such as package delamination, wire bonding failure, and bond pad discoloration. The evaluation results were also used to further correlate with the customer case study to confirm the finding.

Delivery Form: PDF / Article-No: SA2204-01

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