Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
ZESTRON AMERICA'S WHITEPAPER-COLLECTION
Whitepaper-collection Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
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[ZESTRON Americas - Ravi Parthasarathy, M.S.Ch.E.,ITW EAE - Patrick Lawrence, Indium Corporation - Evan Griffith]
ABSTRACT:
As computing chips evolve to offer enhanced functionalities, packages like SiP, fcBGA, PoP, and 2.5D have become more intricate, incorporating larger die sizes, increased bump counts, and lower standoff heights. These advancements have posed challenges in achieving effective cleaning.
The interconnects in these packages commonly use solder. Post-soldering, flux residues create significant cleaning hurdles, particularly beneath low-profile components. With standoff heights decreasing to less than 50μm, outgassing during reflow diminishes, further complicating flux residue removal. Components such as QFNs and LGAs with large thermal pads add to these challenges, risking reliability issues including electrochemical migration and electrical leakage.
Understanding the nuances of cleaning processes, especially in conveyorized spray-in-air inline systems is critical for overcoming these challenges. This study will focus on optimizing cleaning parameters to ensure reliable performance and durability under harsh conditions. From analyzing the arrangement and orientation of spray bars to controlling pressure and spray nozzle distance from the belt of wash and rinse modules, optimizing these parameters is essential to balance cleaning effectiveness while minimizing potential damage to delicate components.
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