ATRON® AC 205

Your Benefits ATRON® AC 205

The FAST® Technology-based cleaning agent is specifically designed to remove flux residues from electronic assemblies. Compared to conventional surfactant-based cleaning agents, it allows for much shorter contact times. Therefore, the cleaning agent is especially suited for high pressure inline cleaning systems where short contact times are required. The product is also suitable for cleaning Power LEDs, Flip Chip Packages, CMOS and BGA.

• Removal of various fluxes
  Allows for a quicker removal of a wide variety of the latest lead-free and eutectic flux residues. In addition, the gentle formula of the cleaner leaves solder joints and pads shiny and bright.
• Long bath life
  The cleaning agent has a higher bath loading capacity and thus longer bath life compared to conventional surfactant-based cleaners.
• Optimal preparation for subsequent processes
  For Flip Chips/CMOS, the cleaning agent reduces the void rate during underfill and improves the image resolution by removing all tacky fluxes. Due to its optimal flux removal after die attach, it increases wire bonding quality as well as light conversion and life time of Power LEDs.
• Low VOC content & free of harmful substances
  Free of Ethanolamine and other harmful substances, extremely low VOC value.
• Manual concentration measurement
  The ZESTRON® Bath Analyzer 10 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.
• Cleaning agent regeneration
  During the use of ATRON® AC 205, the ZESTRON® Adsorber HM1 can remove heavy metals from the cleaning bath.