VIGON® SC 210

Your Benefits VIGON® SC 210

The MPC® cleaner for SMT stencils reliably removes solder paste and SMT adhesives in a single process and provides optimal cleaning results even at low temperatures. Depending on the flux type, it can also be used for misprint cleaning. Another area of application is the removal of adhesives from tools (particularly dispensing needles). The cleaning agent is designed to be used in either spray-in-air or ultrasonic cleaning equipment.

• Consistently good cleaning results even at low temperatures
  The cleaner shows constantly good cleaning results at temperatures between 18-40°C/64-104°F.
• Low VOC content
  The VOC value is significantly below 20 %, therefore easy compliance with local regulations on VOC emissions.
• Excellent material compatibility
  The cleaner shows excellent material compatibility with SMT stencils.
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• No flash point
  The cleaning agent has no flash point and thus can be applied without explosion-proof protection.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON EYE. The ZESTRON Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.