VIGON® A 201

Your Benefits VIGON® A 201

The MPC®-based cleaning agent is especially suitable for the removal of flux residues from leaded as well as lead-free No-Clean solder pastes and provides shiny solder joints after cleaning without the need for additives. It provides excellent cleaning performance in spray-in-air processes for the cleaning of capillary spaces, e.g. under low standoff components.

• Suitable for low-standoffs
  It successfully cleans under low standoff components such as Micro BGAs, Flip Chips, and 01005 components.
• Long bath life, low costs
  High bath loading capacity ensures extended bath life, low maintenance cost and reduced cost per cleaned part.
• Residue-free cleaning
  Easy to rinse and does not leave any residues on the surfaces.
• Optimal preparation for subsequent processes
  For Flip Chips/CMOS, the cleaning agent reduces the void rate during underfill and improves the image resolution by removing all tacky fluxes. Due to its optimal flux removal after die attach, it increases wire bonding quality as well as light conversion and life time of Power LEDs.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON® EYE. The ZESTRON® Bath Analyzer 10 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.
• Cleaning agent regeneration
  During the use of VIGON® A 201, the ZESTRON® adsorber HM1 can remove heavy metals from the cleaning bath.