Determining the Effect of Fine Mesh Solder Powder on Flux Residue Removal
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Whitepaper-collection Determining the Effect of Fine Mesh Solder Powder on Flux Residue Removal
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[ZESTRON Americas - Ravi Parthasarathy, M.S.Ch.E. & Kalyan Nukala, M.S.Ch.E.; AIM - Timothy O’Neill; Foresite - Terry Munson]
ABSTRACT:
Solder paste users and developers face an unrelenting drive to miniaturize solder paste deposits. A key element to success is the incorporation of smaller solder particles in the solder paste. New flux formulas have been developed in parallel to enhance printing and soldering performance with finer powder. The focus of this development has been primarily on ‘No-Clean’ chemistries as this flux technology has emerged as the industry standard. While No-Clean flux residue is designed to be left in place after soldering, there are a variety of end use applications that require its removal including coating applications, RF and high voltage circuitry. When flux residue removal is mandated, wash chemistry is required in order to solubilize flux residue so that it can be washed and rinsed away.
Based on this analysis, Phase 2 trials were conducted utilizing the IPC-B-52 test vehicle cleaning agents yielding best and worst cleaning results from Phase 1. In this phase, cleanliness assessment was conducted using SIR and Ion Chromatography analyses. The results were analyzed to assess the influence of finer solder powder paste deposits on the cleaning process and materials. All cleanliness assessments were conducted in accordance with current IPC guidelines.
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