Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?
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Whitepaper-collection Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?
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[ZESTRON Americas - Jigar Patel and Umut Tosun]
ABSTRACT:
OEMs and CMs designing and building electronic assemblies for high-reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented.
If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent.
Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system.
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