HYDRON® SE 230A

Your Benefits HYDRON® SE 230A

Water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It reliably removes flux residues from all kind of semiconductor electronics, such as leadframes, discrete devices, power modules and power LEDs as well as flip chip or CMOS, i.e. after die attach. The cleaner is also recommended for defluxing after wafer bumping in single or batch wafer processing equipment.

• Optimal surfaces for subsequent processes
  The product delivers excellent deoxidation of Cu substrates, provides stainless, activated copper surfaces for subsequent processes such as wire bonding, moulding and adhesive bonding and retains these activated surfaces over a temporary storage time.
• Very good processability in dip tank processes
  Due to its single-phase formulation, it can be easily processed and provides excellent performance in dip tank processes. Moreover, it can be easily rinsed off with DI-water without leaving any residues.
• Ideally suited for low-standoffs
  Featuring a very low surface tension, it works exceptionally well for cleaning capillary spaces, i.e. underneath low stand-off components.
• Excellent material compatibility
  High level of material compatibility on sensitive materials such as copper, aluminum and specifically nickel.
• No flash point
  The low odor cleaning agent has no flash point and can therefore be used in all common dip tank processes.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON® EYE. The ZESTRON® Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.