Reliability & Solutions
Risk Assessment & Mitigation for Electronic Assemblies
At ZESTRON, our Reliability & Solutions (R&S) team is committed to ensuring the long-term reliability and performance of your electronic assemblies. From design to high-volume production and field deployment, we provide comprehensive support across the entire value chain. Our services utilize advanced precision tools and expert analysis to identify potential risks early, address vulnerabilities, and optimize processes to prevent costly failures.
Our Process
Partner with us to uncover risks, prevent failures, and optimize your processes for sustainable success. We believe in proactive risk assessment and mitigation to ensure the success of electronic assemblies throughout product development and new product introduction. By leveraging our subject matter expertise in failure analysis and product development, we enable long-term reliability, helping our customers deliver high-quality, dependable products.
Product Assessment Stages
Design Risk Assessment: Collaborative design review; early evaluation of products, processes, and materials to identify potential vulnerabilities.
Early-Stage Analysis: Pre-production assessments for maximum reliability.
Reliability Testing: Conducting reliability and endurance testing to verify compliance with customer quality benchmarks and industry standards.
Root Cause and Failure Mode Analysis: Analytical testing to uncover root causes, providing detailed evidence for product liability claims or vendor returns and delivering actionable solutions and improvement strategies.
Propose Solutions: Tailored, sustainable strategies and solutions for long-term success.
Have you been experiencing electrical failures?
Our Failure Analysis process thoroughly examines key areas to identify potential issues and ensure product reliability. We analyze the printing, placement, and profiling stages to detect any process-related concerns. Component-level assessments focus on first-level contamination, warpage, and metallurgy, while PCB evaluations cover plating quality, assembly integrity, and contamination risks. Additionally, we assess product stress factors, including in-circuit testing (ICT), handling, warpage, device location, final assembly, and environmental conditions, to provide a comprehensive analysis that enhances performance and durability.
Failure Categories
Our Expertise and Experience is Your Success
Process
Print, Placement, Reflow Profile, Electronics Cleaning
Component
First Level Contamination, Warpage, Metallurgy
PCB
Plating Quality, Assembly, Contamination
Product Stress
Handling, warpage, device location, final assembly, environment
Electrical Failures
Understanding Failure Mechanisms Leads to Reliable Products
1. Electrochemical Migration (ECM)
Short circuits due to dendrites on the PBA surface when moisture condenses.
2. Anodic Migration Phenomenon
ECM between layers after degradation of the layer bonding.
3. Water Treeing
Combination of AMP and partial discharge in micro-gaps and pores.
4. Insertion Loss
Interference of the insulation resistance at switching frequencies from 100kHz through moisture or particles.
5. Parasitic Leakage Current
Formation due to moisture on/in polymeric protection systems or at temperatures above 120°C.
6. Thermal Incident
Short circuit caused by conductive particles.
What Makes Us Different?
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Global Support
committed to ensuring your long-term reliability
Our international team consists of experienced experts in surface analysis, materials science, stress testing, and electronics manufacturing. For years, we have been supporting customers around the world with issues relating to humidity robustness, technical cleanliness, product design, and reliability of electronic assemblies.
Looking to get started?
Our experts are ready to help assist you with any question you have.