Wafer Bump Defluxing That Works.Wafer Cleaning
The wafer cleaning process involves using our specialized cleaning solutions designed to remove contaminants such as particles, organic residues, and metal ions from the surface of the wafer. Our cleaning solutions are formulated based on the type of contaminant to be removed and the substrate material of the wafer.
Quick. Clean. Safe.
ZESTRON's cleaning ability includes Wafer Bumping Defluxing and PR Stripping:
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Pre-soldered Si-Wafer with Power Dies
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Glass Wafer with Structured Solder Joints
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Si-Wafer with Solder Bumps
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Copper Wafer with Photo Resist
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CoW (Chip on Wafer)
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Silicon Ingot Cutting and Wafer Dicing
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Single Wafer and Magazine Cleaning
Water & Solvent Based Soultions
Using innovative technology to push traditional packaging beyond typical limits?
Don’t let flux contamination get in the way of performance and reliability.
- Rapid Results
Achieve a complete clean in under a minute, meeting or exceeding standard productivity expectations.
- Consistently Clean
Remove particulates and impurities, reducing crystal defects, interconnect failures, oxidation, corrosion, migrating satellites and delamination all without the risk of material compatibility impact of sensitive metals.
- Cost Saving
Increased savings in terms of reduced process time and increased throughput
- Safe & Sound
Benefit from a environmentally friendly, aqueous solution with zero flash point and no specialized waste water disposal requirements.
THE RESULTS ARE CLEAR.
OUR SOLUTIONS REDUCE CARBON CONCENTRATIONS FROM 55% TO 0.1%
Pre-Clean | EDX
Clean | EDX
EDX - Energy-dispersive X-Ray Spectracopy
Pre-Clean | SEM
Clean | SEM
SEM - Scanning Electron Micrscope