For component types such as FCBGA, FCmBGA, and micro-FCBGA, the electrical contacts (bumps) are soldered onto the component base, utilizing a combination of Flip Chip and BGA structures whereas using a reflow process. For the die attach process during Flip Chip manufacturing, flux pastes (tacky fluxes) are required and applied via a dispenser, spraying, or a chip dip process. Removing all flux residues from the tight spaces between the Flip Chip and the base material is required to achieve complete and void-free wetting of all materials for the underfill process.
- Excellent wetting characteristics for the cleaning agent to properly penetrate the capillary spaces and remove the flux residues
- Excellent rinsability of the cleaning agent to ensure the complete removal of residues under components
- Residue-free drying to ensure a completely cleaned package
ZESTRON's aqueous and solvent-based cleaning media developed for Flip Chip processing guarantees proper underfill wetting, thereby preventing underfill voids.