for professionals. by professionals.2025 Webinar Series
ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series.
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Why Clean?
April 17th - 2:00 PM EDT
Umut Tosun M.S.Ch.E., Director of Engineering
No manufacturer wants to add unnecessary steps to production—but when it comes to cleaning printed circuit board assemblies (PCBAs), the benefits far outweigh the costs. So why has cleaning become essential in many electronics production lines?
In this webinar, we’ll explore the impact of contamination on PCBA reliability and why effective cleaning is crucial for mission-critical applications. From aerospace and medical devices to military and automotive electronics, we’ll discuss how proper cleaning extends product lifespan, ensures performance, and meets the stringent requirements of high-reliability industries.
Join us to learn why cleaning isn’t just an option, it’s a necessity for long-term success.
Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability
May 22nd - 2:00 PM EDT
Denis Barbini Ph.D., Technical Solutions Manager
When a product fails in the factory or worse, in the field, a significant effort is required to determine the root cause of the failure. This includes a forensic accounting of all potential failure sources including environmental conditions, product design, assembly processes and handling. In addition, the board design, component selection and fixtures can influence the mechanism for failure.
This webinar focuses on lessons learned from a variety of commonly observed issues as well as the more challenging applications that the Zestron Reliability and Solutions team have encountered.
Optimizing PCBA Cleaning: Cutting Costs & Boosting Capacity
September 23rd - 2:00 PM EDT
Joshua Archer, Sales Engineer
Struggling with rising costs and production bottlenecks in your PCBA cleaning process? Join ZESTRON Academy’s Joshua Archer for an in-depth session on maximizing efficiency without compromising reliability. Learn how contract manufacturers can optimize cleaning operations through strategic equipment selection, chemical usage, and fine-tuned process settings. Gain actionable insights to reduce costs, increase capacity, and enhance overall process performance. Don’t miss this opportunity to improve your bottom line—register today!
Ensuring Reliability in Advanced Packaging: The Cleaning Challenge
October 9th - 2:00 PM EDT
Kalyan Nukala, M.S.Ch.E., Applications Engineer
As semiconductor packaging evolves with technologies like SiP, fcBGA, PoP, and 2.5D, achieving effective cleaning has become more complex. Larger die sizes, increased bump counts, and lower standoff heights create significant challenges in removing flux residues, especially under low-profile components.
With standoff heights now below 50μm, reduced outgassing during reflow makes flux removal even more difficult, increasing the risk of electrochemical migration and electrical leakage. Components like QFNs and LGAs with large thermal pads further complicate the process.
In this webinar we will review how proper cleaning strategies are critical to ensuring long-term reliability in these advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications.
All Spanish webinarsA Webinar Series on the Latest Innovations, Cleaning, and Corrosion Challenges
ZESTRON Academy is proud to present the LATAM webinar series! This is a free educational opportunity providing valuable knowledge on the latest advancements and trends within the SMT, Advanced Packaging, and Power Electronics sector. This series is an excellent way to stay up-to-date and enhance your understanding of semiconductor materials, processes, and equipment.
Limpieza de Esténciles y Tarjetas Mal Impresas
Thursday April 3rd at 11:00 am CST- TRANSMISIÓN EN ESPAÑOL
Andres Turrubiates, Sr. Application Engineer
El objetivo de la presentación es mostrar algunas de las recomendaciones principales sobre el proceso de limpieza de tarjetas mal impresas, así como el cuidado de los esténciles para mejorar los métodos de impresión de pasta dentro de los equipos de lavado de esténciles y tarjetas, así como en impresoras de pasta en el área de SMT.
Mostrar las tendencias y diferencias de los limpiadores tradicionales contra los agentes de limpieza de nueva generación buscando con ello mejorar y eficientar proyectos de mejora y planes sustentables de ahorro, reduciendo con ello también los defectos generados durante el proceso de impresión de pasta de soldadura en el área de SMT.
Underside Wipe Cleaning: Optimización y Mejores Prácticas en la Limpieza de PCBs
September 25th - 11:00 AM CST - TRANSMISIÓN EN ESPAÑOL
Javier González, Application Engineer | Daniel Chacón, RSM Mexico & Latin America
El Underside Wipe Cleaning es un proceso clave en la impresión de pasta de soldadura para garantizar la calidad y confiabilidad de las placas de circuito impreso (PCBs). En este webinar, exploraremos la importancia de una limpieza eficiente, los factores que afectan su desempeño y las mejores prácticas para optimizar el proceso. También analizaremos los tipos de materiales de limpieza, su impacto en la reducción de defectos y estrategias para maximizar la productividad en la manufactura electrónica.
La Pesadilla del Conformal Coating: Identifica y Evita Defectos
November 6th - 11:00 AM CST - TRANSMISIÓN EN ESPAÑOL
Mario Saavedra | RSM Mexico Central & LATAM
Este webinar analiza los defectos comunes en las aplicaciones de Conformal Coating. Cubre las características generales del Conforma Coating, las definiciones de defectos según IPC-A-610G, las causas comunes (limpieza, aplicación, curado) y tipos específicos de defectos como la falta de uniformidad, humectación deficiente, efecto ojo de pez, huecos/burbujas, grietas/ondulaciones, delaminación, piel de naranja y arrugas/ondas.
La presentación destaca la importancia de una limpieza adecuada de la PCB antes del recubrimiento para evitar defectos en los procesos productivos.