VIGON® PE 305N

Your Benefits VIGON® PE 305N

Water-based, pH-neutral MPC® cleaning agent specifically developed for Power Electronics. The product reliably removes flux residues, especially from synthetic solder pastes as well as organic layers after sintering. It shows very good material compatibility with sensitive metals and dies and is suitable for spray-in-air batch and inline equipment.

• Excellent cleaning performance for soldering and sintering processes
  The cleaning agent reliably removes flux residues, especially from synthetic solder pastes, from power modules after soldering, e.g. after die attach or heat sink soldering as well as organic layers and Cu oxidation after sintering process. Therefore, the product is highly recommended for complex power module production with several soldering and/or sintering processes.
• Optimal copper surfaces for subsequent processes
  The product provides stain-free, activated copper surfaces for subsequent wire bonding, molding or adhesive bonding.
• Excellent material compatibility
  The pH-neutral formulation results in an excellent material compatibility, specifically with dies. No attack of passivation occurs.
• No flash point
  The cleaning agent has no flash point and no foaming, and is thus applicable in all spray-in-air equipment without explosion proof.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON® EYE. The ZESTRON® Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.