High Power Electronics Cleaning Requirements for Improved Efficiency and Reliability

Today, power modules are widely used in high-power applications such as hybrid electric vehicles, solar inverters, medical equipment, and UPS (Uninterruptable Power Supplies) devices. For energy efficiency reasons, high-power devices such as MOSFETs, IGBTs, and DCBs are subjected to increased performance requirements with greater packaging density and involve various metal material mixes.

Moreover, they oftentimes are subjected to elevated temperature and power cycling environments, extremely high current flow, and extreme thermal transfer requirements. Accordingly, even the slightest contaminants remaining on the surface will impede the reliability required in these critical and highly sensitive applications.