HYDRON® SC 300

Your Benefits HYDRON® SC 300

The water-based, single-phase cleaning agent for SMT stencils reliably removes solder pastes and SMT adhesives at room temperature. It is recommended for cleaning and rinsing and dries residue-free. In addition, the product can be used for stencil underside wiping in SMT printers.

• Excellent cleaning performance & streak-free stencils
  Excellent cleaning performance on solder pastes and SMT adhesives; it does not leave any pigment residues on the surfaces. Furthermore, the cleaning agent dries without leaving residues when fresh and does not leave any streaks on stencils.
• Closed-loop system & free of rinsing water
  The cleaner is applicable in closed-loop systems and can be used to clean and rinse stencils, eliminating the need for rinsing water and thus waste water. This means that the cleaner can also be used in 1-tank systems.
• Excellent material compatibility
  Excellent material compatibility with stencils. The cleaning agent has been approved by leading international manufacturers for the use in their stencil printers. Written approvals can be obtained.
• Low VOC content
  Low VOC content < 20 %, therefore no subject to approval.
• No flash point
  The cleaning agent is water-based, has thus no flash point and can therefore be applied without explosion-proof protection.
• Manual concentration measurement
  The ZESTRON® Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.