VIGON® SC 200
Water-based stencil cleaner for the removal of solder pastes and SMT adhesives

Your Contact
ZESTRON EUROPE
Phone
+49 (0) 8453 / 41995318
Find your local sales and distribution partner
Your Benefits VIGON® SC 200
The MPC® cleaner reliably removes solder pastes and SMT adhesives from SMT stencils and can also be used in SMT printers for underside wiping and misprinted assemblies. Depending on the type of fluxes, VIGON® SC 200 can also be used for misprints on double-sided PCBAs with one side already soldered. The cleaning agent is designed for the use in spray-in-air and ultrasonic cleaning systems.
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Long bath life, low costs
The cleaner is characterised by its high bath loading capability, very good filterability and therefore a long bath life as well as low maintenance costs. -
Closed-loop system & free of rinsing water
The cleaner is applicable in closed-loop systems and can be used to clean and rinse stencils, eliminating the need for rinsing water and thus waste water. This means that the cleaner can also be used in 1-tank systems. -
Excellent material compatibility
Due to its mild formulation, the medium shows excellent material compatibility with stencils and cleaning machines. -
No flash point
It is a water-based cleaner without flash point, therefore, no explosion-proof protection is required. -
No foaming, low odor and germ-free
No foaming when used in spray-in-air systems, low odor, no building of organics in the rinsing section. -
Concentration measurement - manual & automatic
The cleaning agent can be measured automatically and digitally in real time with the ZESTRON EYE. The ZESTRON Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.
Product features

Stencils & Screens

Underside wiping

MPC® Technology

PH neutral