Boosting Efficiency in High-Voltage Production

Risk Analysis: Can Technical Cleanliness Be Ensured Without the Intermediate Step of Electronics Cleaning?

risk assessmentIs Technical Cleanliness Ensured?

Sensitive high-voltage components can be compromised by particulate contamination from previous process steps. To minimize this risk, many production lines incorporate additional cleaning systems for particle removal.

This was the case for our customer, who implemented an extra cleaning step before applying the protective coating to reduce residual contamination risk as much as possible. However, since the protective coating also serves as an insulating material and could potentially provide sufficient protection, the question arose whether this additional cleaning step was truly necessary.

By potentially eliminating the cleaning step, the customer could not only make their processes more efficient but also achieve significant cost savings without compromising quality.

A laboratory employee sits at his desk and looks at a picture of an electronic assembly on the computer screen to analyse the purity determination. | © @The Sour Cherry Fotografie - Michaela Curtis

challengeTechnical Cleanliness Without Additional Cleaning?

The customer faced a crucial question: Can the technical cleanliness of the high-voltage assembly be ensured without the additional cleaning step? And will the high quality standard be maintained? These considerations were focused on optimizing production processes without compromising on quality.

investigationClimate Stress Test to Ensure Technical Cleanliness

To determine if the protective coating would suffice without prior cleaning, the assembly underwent a comprehensive climate stress test—both with and without particulate contamination.

The results demonstrated that the technical cleanliness and the durability of the assembly under humid climate conditions were maintained even without the additional cleaning step. This opened up the possibility of eliminating the particle removal system.

The picture shows assemblies undergoing a comprehensive climatic stress test. | © hamster – stock.adobe.com

more analysisWeakness in Protective Coating Discovered

Upon further analysis, a critical weakness was identified. The insulating material exhibited insufficient protection against moisture exposure under high voltage conditions. This weakness could have compromised the functionality of the assembly and led to a higher failure rate in the worst-case scenario.

The picture shows an assembly being tested under high voltage and moisture stress.

SolutionOptimizing Insulating Material for Maximum Technical Cleanliness

After the analysis revealed that the insulating material provided insufficient protection under moisture and high voltage conditions, prompt action was required. To address this issue, new process parameters were developed to improve the ventilation and drying of the insulating material. These optimizations led to a higher degree of material crosslinking, preventing degradation under combined stresses.

As a result of these measures, the customer was able to ensure technical cleanliness, reduce costs, and maintain the high quality and reliability of their end products.


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whitepaper-collectionTechnical Cleanliness in Electronics Manufacturing

Technical Cleanliness Electronics Manufacturing

Discover the risks of particle contamination in the electronics industry and explore effective cleaning methods to ensure technical cleanliness. Request information now to meet customer expectations and reduce particle loads.

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Surface cleanliness Zestron Strixner | © @The Sour Cherry Fotografie - Michaela Curtis
Author: Stefan Strixner
PCB_surface_particle_measurement

technologie coachingRisk Assessment of Particles on Electronic Assemblies

employee carries out an analysis of technical cleanliness to identify causes of failure due to particles in electronic components. | © @The Sour Cherry Fotografie - Michaela Curtis

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