VIGON® SC 200
Water-based stencil cleaner designed for the removal of solder pastes and SMT adhesives from stencils
Your Benefits VIGON® SC 200
A water-based cleaning agent designed to reliably remove solder pastes and SMT adhesives from stencils at room temperature and in one single process. It is designed for use in spray-in-air and ultrasonic cleaning systems.
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High bath loading capability
The MPC® Technology provides extended bath life resulting in reduced cleaning agent costs and an increase in process efficiency -
Excellent material compatibility
Safe on nano coating this aqueous-based, surfactant-free cleaner leaves no residues on substrates or inside the equipment -
Multiple application use
VIGON SC® 200 can be used for stencil underside wipe processes in printers, cleaning misprinted solder paste and depending on the type of flux, may also be suggested for both double-sided and single-side soldered circuit boards.
Product features
Stencils & Screens
Underside wiping
MPC® Technology
PH neutral