HYDRON® SE 220

Your Benefits HYDRON® SE 220

A water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of PCB and semiconductor electronics, such as leadframes, discrete devices, power modules, power LEDs, flip chips, and CMOS following the die attach process. 

• Excellent material compatibility 
  The pH neutral design provides excellent material compatibility, specifically with power modules and die surface passivation which includes aluminum, copper, etc. Also compatible with OSP surface finish
• Eliminates risk of reoxidation
  Retains activated copper surfaces over an extended period of time without risk of reoxidation
• Ideal for subsequent processes
  The pH neutral formulation results in stain-free activated copper surfaces for subsequent processes such as wire bonding (gold and aluminum), molding and adhesive bonding.
• Low cost solution for an automative cleaning process
  Using Hydron® SE 220 will ensure reliable cleaning underneath components at a low start up cost, ideal for Class 3 assemblies.
• Concentration measurement - manual & automatic
  The cleaning agent can be measured automatically and digitally in real time with the ZESTRON® EYE. The ZESTRON® Bath Analyzer 20 can be used as a manual measuring method for a quick and easy check of the cleaning agent concentration.