VIGON® SC 210

Your Benefits VIGON® SC 210

A water-based cleaning agent designed to reliably remove solder pastes and SMT adhesives from stencils at room temperature and in one single process. It is designed for use in spray-in-air and ultrasonic cleaning systems. VIGON® SC 210 is designed to be used in spray-in-air and ultrasonic cleaning systems.

• High bath loading capability
  The MPC® Technology provides extended bath life resulting in reduced cleaning agent costs and an increase in process efficiency
• Excellent material compatibility
  Safe on nano coating this aqueous-based, surfactant-free cleaner leaves no residues on substrates or inside the equipment
• Provides excellent cleaning results, even at low temperatures.
  Consistently good cleaning results at temperatures between 18-40°C/64-104°F
• Multiple application use
  VIGON SC® 210 can also be used to remove adhesives from tools, particularly dispensing needles, as well as for cleaning misprints.
• No flash point
  No flash point and thus, can be used without explosion-proof protection
• Concentration measurement - manual & automatic
  Can be measured automatically and digitally in real time with the ZESTRON EYE, ZESTRON EYE Mobile or ZESTRON EYE CM. The ZESTRON Bath Analyzer 20 is available as a manual measurement method for quick and easy checking of the cleaner concentration.