High Power Electronics: Cleaning Requirements for Improved Efficiency and Reliability
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During the power module manufacturing process, contaminants including oxide films and flux splatter remain on the substrate and chip surfaces. In order to guarantee the highest process reliability, these contaminants must be completely removed from the surfaces through a cleaning process.
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Article number: US-1605-01
This paper details power module applications including typical qualification tests, failure mechanisms and considerations for cleaning processes. Subsequent to its release, engineered aqueousbased cleaning agents have been incorporated into power module manufacturing processes. Several customer case studies highlighting this cleaning alternative and the reliability impact on the process are detailed within this paper.